X-Ray Inspection System

Our 3D X-Ray equipment can automatically measure the ball size, volume and density of every solder joint; this means we can monitor our production process and ensure that we are manufacturing your product to the highest standard.

With PCB land space at a premium and the constant miniaturization of electronic assemblies, high-density connection devices such as BGA, LGA, PoP, Flip chip and many other invisible joint devices are becoming more and more common.

With new BGA devices using a center-to-center pitch of just 0.3mm between ball joints X-Ray inspection of all non-visible solder joints is crucial. For effective inspection of all PCB assemblies, Bangyan recently invested in a Yamaha 3D X-Ray machine.