Communication

PCB Board Assembly

* Through Hole PCB Assembly

* Surface Mount (SMT) PCB Assembly

* Mixed or Complex SMT and Through Hole PCB Assembly

* PBGA (Pitch Ball Grid Array), FBGA (Fine Ball Grid Array), Micro-BGA, CSP, Ultra-fine pitch QFP and QFN

* Thick/Thin Film

* Fine Pitch (0201 and 01005) components

* High-Mix and Low-Medium Volume

* Through Hole to SMT conversion

* Conformal Coating & Epoxy Potting

* Rapid Prototyping

* Box Build/Final assembly

* Turnkey Manufacturing

* Wire and Cable Harnessing

* Board Level or System Level Testing

* Lead-Free, RoHS Compliant, and Non-RoHS Process

* Online Quality Control

PCBA Manufacturing Service

* PCB fabrication from 1-32 layer. (single side, double side, multi-layer, HDI board, bury & blind holes board etc)

* Material procurement and management

* Quick-turn PCBA Prototype and NPI (new product introduction)

* PCBA and through hole assembly

* IC pre-programming & Function verification & burn in testing

* Complete Unit assembly (Box building include the plastic, screen, metal enclosure, membrane, coils, wire harness etc.)

* Small volume is accepted and High-mix models solutions

* AOI, In circuit test, BGA placement

* Engineering support including end of life and obsolete component replacement and design support for circuit, metal,plastic casing and packaging

PCB Manufacturing Capability

PCBA Manufacturing Delivery Duration

Delivery for samples will be 10-15 days after OEM Contact is signed and the Engineering Documents are confirmed.

For Mass production, based on the customer requirements, delivery can be done in several batches.