* Through Hole PCB Assembly
* Surface Mount (SMT) PCB Assembly
* Mixed or Complex SMT and Through Hole PCB Assembly
* PBGA (Pitch Ball Grid Array), FBGA (Fine Ball Grid Array), Micro-BGA, CSP, Ultra-fine pitch QFP and QFN
* Thick/Thin Film
* Fine Pitch (0201 and 01005) components
* High-Mix and Low-Medium Volume
* Through Hole to SMT conversion
* Conformal Coating & Epoxy Potting
* Rapid Prototyping
* Box Build/Final assembly
* Turnkey Manufacturing
* Wire and Cable Harnessing
* Board Level or System Level Testing
* Lead-Free, RoHS Compliant, and Non-RoHS Process
* Online Quality Control
* PCB fabrication from 1-32 layer. (single side, double side, multi-layer, HDI board, bury & blind holes board etc)
* Material procurement and management
* Quick-turn PCBA Prototype and NPI (new product introduction)
* PCBA and through hole assembly
* IC pre-programming & Function verification & burn in testing
* Complete Unit assembly (Box building include the plastic, screen, metal enclosure, membrane, coils, wire harness etc.)
* Small volume is accepted and High-mix models solutions
* AOI, In circuit test, BGA placement
* Engineering support including end of life and obsolete component replacement and design support for circuit, metal,plastic casing and packaging
Surface processing | HASL/Plating gold / immersion gold /Plating gold finger/OSP/ Flux |
Layers | 1~32 layers |
Copper Thickness | O.5OZ~5OZ |
Board Thickness | 0.2mm~6.0mm |
Min Hole Size | 0.2mm |
Min Line Width | 0.1mm |
Min Line Spacing | 0.1mm |
Max board Size | 508mm*609mm |
Solder mask type | Green/ Black/ Red/ Yellow/ White/Blue… |
Silkscreen color | White / Yellow/ Black |
Data file format | Gerber file and corresponding drilling file, PROTEL series, BOM list |
Base material | FR4, CEM3, PTFE, Aluminum based, High TG FR4, High frequency board, Rogers |
Delivery for samples will be 10-15 days after OEM Contact is signed and the Engineering Documents are confirmed.
For Mass production, based on the customer requirements, delivery can be done in several batches.